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ICOP & ICPET 2014, 20 - : 893-896 Back to browse issues page
Design Of Experiment(DOE) Inter-Polishing For Improvement Of Cu Surface
Kourosh Sasani Mr. * 1, Mirvahid Shafiei jood Mr.1
1- Iranian National Center for Laser Science and Technology
Abstract:   (2709 Views)
Among the surface finishing processes lapping and polishing are very important for manufacturing and fabricating semiconductor and optoelectronic devices. For copper, the quality of these processes has a critical role in the performance of heatsinks. In this paper an intermediate process named “inter-polishing” was introduced. This process placed after lapping and before polishing. The result is obtaining a surface with more flatness and less hardness that are key parameters to achieve an ideal surface after polishing.
Keywords: Inter-Polishing, Cu, Polishing, Flatness, Hardness
Full-Text [PDF 556 kb]   (835 Downloads)    
Type of Study: Research | Subject: Special
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Sasani K, shafiei jood M. Design Of Experiment(DOE) Inter-Polishing For Improvement Of Cu Surface. ICOP & ICPET. 2014; 20 :893-896
URL: http://opsi.ir/article-1-359-en.html


Volume 20 - Back to browse issues page
انجمن اپتیک و فوتونیک ایران Optics and Photonics Society of Iran
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