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Sasani K, shafiei jood M. Design Of Experiment(DOE) Inter-Polishing For Improvement Of Cu Surface. ICOP & ICPET _ INPC _ ICOFS 2014; 20 :893-896
URL: http://opsi.ir/article-1-359-en.html
URL: http://opsi.ir/article-1-359-en.html
1- Iranian National Center for Laser Science and Technology
Abstract: (4523 Views)
Among the surface finishing processes lapping and polishing are very important for manufacturing and fabricating semiconductor and optoelectronic devices. For copper, the quality of these processes has a critical role in the performance of heatsinks. In this paper an intermediate process named “inter-polishing” was introduced. This process placed after lapping and before polishing. The result is obtaining a surface with more flatness and less hardness that are key parameters to achieve an ideal surface after polishing.
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